16-Layer Heavy Copper PCB for High-Power Applications

1.Introduction to Core Technologies

S1000-2M Laminate

S1000-2M is a high-performance copper-clad laminate (CCL) from Shengyi Technology, specifically designed for high-layer-count and high-reliability PCB applications.

Key Performance Characteristics:

1.High Glass Transition Temperature: Tg (DMA method) ≥180°C, with a typical value of 185°C, ensuring excellent mechanical and dimensional stability in high-temperature environments.
2.Superior Thermal Reliability: Td (5% weight loss) ≥340°C, typical value 355°C; T288 ≥5 minutes (typical value 30 minutes), meeting requirements for lead-free soldering and multiple reflow cycles.
3.Low Z-Axis Coefficient of Thermal Expansion: Z-CTE before Tg ≤60 ppm/°C (typical 41 ppm/°C), helping to improve the reliability of plated through-holes (PTH) during thermal cycling.
4.High CAF Resistance: Tested and passed 1000 hours under conditions of 65°C/87% RH/100V DC, suitable for high-voltage, high-humidity environments.
5.High Peel Strength: 1oz copper foil peel strength ≥1.05 N/mm (typical 1.3 N/mm), ensuring strong interlayer bonding.

When paired with TG170 prepregs (such as 106, 2116), S1000-2M can construct highly reliable multilayer boards suitable for power supplies, servers, communication equipment, and other applications with stringent long-term reliability demands.

What is Heavy Copper?

Heavy Copper PCB refers to circuit boards where the copper thickness on the signal layers is significantly greater than that of conventional PCBs (typically 1oz or 2oz). The industry generally defines PCBs with copper thickness ≥3oz (approximately 105μm) as heavy copper boards, while those ≥6oz can be termed ultra-heavy copper boards.

Functions of Heavy Copper

1.High Current Carrying Capacity: By increasing the conductor cross-sectional area, it significantly reduces trace resistance, minimizing heat generation and power loss when high currents pass through, meeting the needs of high-power equipment.
2.Enhanced Thermal Management: The thick copper layers act as efficient heat spreaders, helping to uniformly conduct heat generated from local hot spots across the board surface or to heat dissipation structures, improving cooling efficiency.
3.Improved Mechanical Strength: Thicker copper layers increase the structural rigidity of the PCB, which is particularly important for large-sized boards or applications requiring support for heavy components.
4.Enables High Power Density Design: Allows for fewer, wider traces to carry the same current within a limited space, saving layout area or enabling more complex high-power circuits.

2.PCB Details

3.PCB Stackup (16-Layer Rigid Structure)

This board features a symmetrical 16-layer structure with a total pressed thickness of 6.7mm. It is constructed by alternately laminating S1000-2M cores and TG170 prepregs, designed to provide stable mechanical support and electrical insulation.

4.Typical Applications

1.Industrial Power & Power Electronics: Power conversion and distribution modules in high-power switch-mode power supplies (SMPS), uninterruptible power supplies (UPS), inverters, and servo drives.
2.New Energy Sector: Main power loops in photovoltaic inverters, wind power converters, electric vehicle on-board chargers (OBC), motor controllers, and battery management systems (BMS).
3.Rail Transportation: Traction converters, auxiliary power systems, and other on-board electrical equipment requiring high reliability and power density.
4.Specialty Power Supplies & Power Transmission: Power components in welding equipment, electroplating power supplies, and control/protection equipment for high-voltage direct current (HVDC) transmission.
5.Aerospace & Defense: On-board power systems, radar transmitters, and electronic countermeasure equipment circuits that need to withstand high current surges and thermal loads.

5.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide

6.Conclusion

This 16-layer heavy copper PCB, leveraging the excellent thermomechanical properties of the S1000-2M high-Tg substrate, the substantial current-carrying and heat dissipation capabilities provided by the 3oz copper per layer, and a robust 6.7mm structure, serves as an ideal solution for high-power, high-reliability challenges. Its design thoroughly considers interlayer insulation, thermal stress matching, and long-term reliability. It is capable of meeting the demands of a wide range of demanding applications, from industrial automation to new energy transportation, providing engineers with a solid hardware platform for designing efficient, compact, and reliable power electronic systems.